Piezoelectric plasma integration generator

Piezoelectric plasma integration generator

Application

• Inkjet, marking and pad printing
• Bonding processes with epoxy, polyurethane and cyanoacrylates etc.
• Potting and dispensing technology
• Joining and assembly technology
• Laboratory and medical technology
• Packaging technology
• Microbiology, microfluid and food technology

Fields of application

• Activation of surfaces of a wide variety of base materials
• Optimization of bonding, printing and lamination processes
• Surface treatment of plastics, glasses, ceramics, metals, composites and natural materials
• Selective improvement of the wettability of a wide variety of surfaces
• Fine cleaning of surfaces
• Alternative to chemical primers, flame treatment processes and mechanical roughening

• Electrical connection: 24 V DC
• Power consumption: max. 18 W
• Weight: 370 g
• Design: Integration unit with gas connection
• Plasma temperature: < 50 °C
• Typical treatment speeds:
  • Finest cleaning: 1-15 mm/s
  • Bonding processes: 10-150 mm/s
  • Printing processes: 100-1500 mm/s
• Typical treatment distance: 2 – 10 mm
• Typical treatment width: 5 – 29 mm